Title:
JOINT MATERIAL
Document Type and Number:
Japanese Patent JP2019123637
Kind Code:
A
Abstract:
To provide a joint material suitable for low temperature joint of a location requiring electric insulation when a low melting point lead-fee glass frit is used.SOLUTION: The joint material has an electric insulation substrate, a first adhesive layer laminated on one surface of the electric insulation substrate, and a second adhesive layer laminated on the other surface of the electric insulation substrate, in which the first adhesive layer and the second adhesive layer contain a low melting lead-free glass containing VOand TeOas chemical components and having softening point of 360°C or lower, and outline of the first adhesive layer is included in outline of the second adhesive layer when outlines of the first adhesive layer, the electric insulation substrate and the second adhesive layer respectively are projected in parallel to a lamination direction.SELECTED DRAWING: Figure 1
Inventors:
NAITO TAKASHI
TACHIZONO SHINICHI
YOSHIMURA KEI
HASHIBA YUJI
ONODERA TAIGO
MIYAKE TATSUYA
KONNO TETSUTOYO
TACHIZONO SHINICHI
YOSHIMURA KEI
HASHIBA YUJI
ONODERA TAIGO
MIYAKE TATSUYA
KONNO TETSUTOYO
Application Number:
JP2018004733A
Publication Date:
July 25, 2019
Filing Date:
January 16, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C03C8/16; B32B17/10
Domestic Patent References:
| JP2009199758A | 2009-09-03 | |||
| JP2013157161A | 2013-08-15 |
Foreign References:
| WO2017126378A1 | 2017-07-27 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation