Title:
JOINT STRUCTURE BETWEEN METAL COMPONENTS AND JOINING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2014176857
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a joint structure and a joint method between metal components which can join the metal components each other by an easy structure or method.SOLUTION: A flange 24 is formed on the circumference of a metal cap 21. A wire 25 is arranged annularly on the undersurface of the flange 24. Preferably, the wire 25 is fastened temporarily to the undersurface of the flange 24. The wire 25 to be used has the melting point ranging from -150°C to +150°C for the melting point of the metal cap 21 and a metal base 22. The flange 24 and the metal base 22 of the metal cap 21 are piled up while nipping the wire 25. Then, the electric current is flowed between the flange 24 of the metal cap 21 and the metal base 22, melting the wire 25 so as to perform resistance welding for the flange 24 and the metal base 22.
Inventors:
YOSHIOKA HIDEKAZU
NAGASAKA SHOGO
TSUCHIDA MAKOTO
YOSHIDA HITOSHI
NAGASAKA SHOGO
TSUCHIDA MAKOTO
YOSHIDA HITOSHI
Application Number:
JP2013051049A
Publication Date:
September 25, 2014
Filing Date:
March 13, 2013
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
B23K11/00; B23K11/14; H01H11/00; H01H49/00; H01H50/02
Domestic Patent References:
| JPH0663759A | 1994-03-08 | |||
| JP2002075108A | 2002-03-15 | |||
| JPH1177316A | 1999-03-23 | |||
| JPH0999376A | 1997-04-15 | |||
| JPH07227680A | 1995-08-29 |
Foreign References:
| US20090294411A1 | 2009-12-03 |
Attorney, Agent or Firm:
Masafusa Nakano
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