Title:
接合構造及び光デバイス
Document Type and Number:
Japanese Patent JP7302299
Kind Code:
B2
Abstract:
To provide a junction structure and optical device including the same, capable of high adhesion reliability.SOLUTION: A junction structure 2A includes a base part 6 and an optical component 8 joined to the base part. The base part includes a substrate 14 and a base component 16 provided on the substrate. The base component includes an oxidation region on at least a surface 161 on the opposite side to the substrate, and the optical component is bonded to the oxidation region with adhesive agent 12.SELECTED DRAWING: Figure 1
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Inventors:
Yuki Nakamura
Takashi Kyono
Takashi Kyono
Application Number:
JP2019103055A
Publication Date:
July 04, 2023
Filing Date:
May 31, 2019
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01S5/0239; G02B7/00; G02B7/02; H01L23/38; H01S5/02315; H01S5/024
Domestic Patent References:
| JP2003318002A | ||||
| JP2001215372A | ||||
| JP2017126618A | ||||
| JP2008026462A | ||||
| JP2009282340A | ||||
| JP2010212491A | ||||
| JP2001308443A | ||||
| JP2004348115A |
Foreign References:
| US20030231666 | ||||
| WO2017199541A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
▲高▼木 邦夫
Shotaro Terazawa
Kenichiro Wada
Yoshiki Kuroki
▲高▼木 邦夫
Shotaro Terazawa
Kenichiro Wada
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