Title:
JUNCTION STRUCTURE OF SEMICONDUCTOR CHIP AND METHOD OF JOINING SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JP2010103196
Kind Code:
A
Abstract:
To provide a junction structure of a semiconductor chip and a method of joining a semiconductor chip for ultrasonically joining on a substrate evenly by a plate bump.
In the junction structure of the semiconductor chip 1, a bump 5 of the semiconductor chip 1 is loaded on a land 7 of the substrate 6, the bump 5 is joined to the land 7 by ultrasonic junction, and the semiconductor chip 1 is mounted on the substrate 6. The bump 5 includes a first bump 5a formed on the semiconductor chip 1 and a second bump 5b formed on an inner side from a peripheral edge part of the first bump 5a.
Inventors:
YONEMOTO NOBUJI
WATANABE HIROMICHI
WATANABE HIROMICHI
Application Number:
JP2008271377A
Publication Date:
May 06, 2010
Filing Date:
October 21, 2008
Export Citation:
Assignee:
FUJITSU TEN LTD
International Classes:
H01L21/60; H01L21/607
Attorney, Agent or Firm:
Keiichiro Saikyo
Takeshi Sugiyama
Takeshi Sugiyama