Title:
KENAF BOARD
Document Type and Number:
Japanese Patent JP2004299322
Kind Code:
A
Abstract:
To provide a kenaf board capable of suppressing emission of formaldehyde.
This kenaf board is formed by bonding kenaf fibers obtained by opening the kenaf with an adhesive containing formaldehyde. An adsorbent for adsorbing formaldehyde and binding is stuck on the surface of the board. It is possible thereby to adsorb formaldehyde in the kenaf board by reacting and binding formaldehyde with the adsorbent. Especially, as the kenaf fibers have a large fiber diameter, relatively large and communicating gaps are formed among the kenaf fibers, and it is possible therefore to easily adsorb formaldehyde in the kenaf board through these gaps with the adsorbent.
Inventors:
ONISHI KENJI
OKUDAIRA YUZO
RYU BUNKAI
OKUZAWA MASAYUKI
OKUDAIRA YUZO
RYU BUNKAI
OKUZAWA MASAYUKI
Application Number:
JP2003096845A
Publication Date:
October 28, 2004
Filing Date:
March 31, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B27N3/04; D04H1/04; D04H1/645; D21H11/12; (IPC1-7): B27N3/04; D04H1/04; D04H1/64; D21H11/12
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori
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