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Title:
KEY PAD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE WITH THE KEY PAD
Document Type and Number:
Japanese Patent JP2011165601
Kind Code:
A
Abstract:

To provide a thin key pad with a less variation in the gaps between key tops, a method of manufacturing the same, and an electronic device with the key pad.

The key pad 2 includes a key sheet 10 of a photo-curing resin having a plurality of key tops 11, and an elastic sheet 20 of elastomer fixed to the back side of the key sheet 10. The key sheet 10 has a thickness of 100-500 μm, and integrally includes thin parts 14 of 40 μm or less in thickness connecting the key tops 11 consecutively.


Inventors:
Takahashi, Masahide
Application Number:
JP2010000029929
Publication Date:
August 25, 2011
Filing Date:
February 15, 2010
Export Citation:
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Assignee:
SHIN ETSU POLYMER CO LTD
International Classes:
H01H13/14; H01H11/00; H01H13/70
Attorney, Agent or Firm:
長谷川 洋
中谷 智子



 
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