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Title:
A Kota porous sound base material with the high thermal conductivity to an ultrasonic transducer array
Document Type and Number:
Japanese Patent JP5972296
Kind Code:
B2
Abstract:
A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of graphite foam impregnated with an epoxy resin. The epoxy resin penetrates the porous foam structure at least part-way into the depth of the graphite foam block and, when cured, provides the backing block with good structural stability. The composite graphite foam backing block is bonded to the integrated circuit of a transducer to provide high thermal conductivity away from the transducer and good acoustic attenuation or scattering of rearward acoustic reverberations.

Inventors:
Sudol Voytech
Wicklin Kevin Grayson
Yui Yang Jiang
Knowles Heather Beck
Paolino james
David sen richard edward
Application Number:
JP2013558556A
Publication Date:
August 17, 2016
Filing Date:
March 14, 2012
Export Citation:
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Assignee:
KONINKLIJKE PHILIPS N.V.
International Classes:
A61B8/00; H04R17/00
Domestic Patent References:
JP6335091A
JP2000165995A
JP2010258602A
JP2009505468A
JP2006325954A
JP2008118212A
JP2009504057A
Attorney, Agent or Firm:
Susumu Tsugaru
Fueda Shusen
Takahiro Igarashi