Title:
LED基板の取付装置
Document Type and Number:
Japanese Patent JP4365884
Kind Code:
B1
Abstract:
To unify a configuration for heat dissipation and a configuration for mounting an LED substrate and to facilitate mounting of the LED substrate while increasing heat dissipation efficiency, the disclosed LED substrate mounting device has a lower frame (A) that has a support surface for the LED substrate (B) and lower side walls (2) at the lower parts in the longitudinal direction thereof on both sides, an upper frame (C) that is affixed to said lower frame (A), and the LED substrate (B) that is disposed on the upper surface of the lower frame (A). Both sides of the LED substrate (B) in the longitudinal direction are clamped by the upper surface of the lower frame (A) and a surface (4) formed on the upper frame (C) facing the upper surface of the lower frame (A). The LED substrate (B) is made to have heat conductivity. Both frames (A) and (C) are configured from good heat conductors and heat generated by the LED chip is dissipated via the frames (A) and (C).
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Inventors:
Kobayashi Kiyoyasu
Genma Kazutoshi
Genma Kazutoshi
Application Number:
JP2009027444A
Publication Date:
November 18, 2009
Filing Date:
February 09, 2009
Export Citation:
Assignee:
Kenos Corporation
International Classes:
F21S2/00; F21V19/00; F21V29/00; F21Y101/02
Domestic Patent References:
| JP2002299700A | ||||
| JP2006004929A | ||||
| JP2002299695A | ||||
| JP2006261048A | ||||
| JP4266242B2 |
Attorney, Agent or Firm:
Tadao Mine