LED MODULE - PANASONIC IP MAN CORP

Title:

LED MODULE

Document Type and Number:

Japanese Patent JP2016162971

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an LED module that can enhance the adhesion strength between an LED chip and a mounting substrate and suppress light absorption in the mounting substrate.SOLUTION: An LED module 1a includes a mounting substrate 2a and an LED chip 3. The mounting substrate 2a is provided with an insulating substrate 20 containing resin and glass, a first conductor portion 21, a second conductor portion 22, a third conductor portion 23, and a white resist layer 25. In the white resist layer 25, a first opening 251, a second opening 252 and a third opening 253 that expose the first conductor portion 21, the second conductor portion 22 and the third conductor 23 respectively are formed. The LED module 1a is provided with a wavelength conversion layer 5 disposed between the LED chip 3 and the third conductor portion 23 in the thickness direction of the LED chip 3. The wavelength conversion layer 5 includes phosphor particles that are excited by first light emitted from the LED chip 3 to emit second light of a longer wavelength range than the first light.SELECTED DRAWING: Figure 2

Inventors:

TAKEHARA KOSUKE
FUJITANI NAOKI
TAGAMI NAOKI

Application Number:

JP2015042724A

Publication Date:

September 05, 2016

Filing Date:

March 04, 2015

Export Citation:

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Assignee:

PANASONIC IP MAN CORP

International Classes:

H01L33/50; H01L33/54; H01L33/60; H01L33/62

Domestic Patent References:

JP2012109404A	2012-06-07
JP2012151358A	2012-08-09
JP2004071710A	2004-03-04
JP2012227545A	2012-11-15
JP2007243193A	2007-09-20

Foreign References:

US20060231847A1

2006-10-19

Attorney, Agent or Firm:

Keisei Nishikawa
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki

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