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Title:
LED module
Document Type and Number:
Japanese Patent JP5997766
Kind Code:
B2
Abstract:
The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.

Inventors:
Yoji Urano
Satoshi Nakamura
Ioka Hayato
Ryoji Imai
Jun Goda
Toru Hirano
Masanori Suzuki
Hideaki Hyuga
Application Number:
JP2014518274A
Publication Date:
September 28, 2016
Filing Date:
May 24, 2013
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L33/60
Domestic Patent References:
JP2005209958A
JP2009123908A
JP2011086419A
Attorney, Agent or Firm:
Keisei Nishikawa
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki



 
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