Title:
LEDパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP5246893
Kind Code:
B2
Abstract:
The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.
Inventors:
Lee, Song Gu
Song, Chang Ho
Han, Kyun Tae
Song, Chang Ho
Han, Kyun Tae
Application Number:
JP2011024230A
Publication Date:
July 24, 2013
Filing Date:
February 07, 2011
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01L33/44; H01L33/64; H01L23/29; H01L33/56; H01L33/60; H01L33/62
Domestic Patent References:
| JP2004214436A | ||||
| JP2001036145A | ||||
| JP2002252372A | ||||
| JP2004521506A | ||||
| JP2001185763A | ||||
| JP47018474A |
Attorney, Agent or Firm:
Kyosei International Patent Office