Title:
ＬＥＤパッケージ及びＬＥＤパッケージ用基板
Document Type and Number:
Japanese Patent JP5679441
Kind Code:
B2
Inventors:
斉藤 高志
Application Number:
JP2011082347A
Publication Date:
March 04, 2015
Filing Date:
April 04, 2011
Export Citation:
Assignee:
アピックヤマダ株式会社
International Classes:
H01L33/62; H01L23/50
Attorney, Agent or Firm:
Ryosuke Fujimoto
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