Title:
LED package
Document Type and Number:
Japanese Patent JP6210720
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an LED package which achieve a high heat dissipation effect by providing a pair of P-type electrode part and N-type electrode part in an LED chip on nearly a whole area of a lower surface of a rearrangement wiring layer and forming a pair of blockish conductive heat dissipation parts corresponding to the pair of P-type electrode part and N-type electrode part on a sub-mount substrate.SOLUTION: In an LED package 11 provided with an LED chip 12 having a plurality of element electrodes and a sub-mount substrate 13 on which the LED chip 12 is mounted: a P-type electrode part 18 and an N-type electrode part 19 obtained by rearrangement wiring of the element electrodes are formed on nearly a whole area of a lower surface via a rearrangement wiring layer 17 on the LED chip 12; and a pair of blockish conductive heat dissipation parts 22 provided corresponding to the P-type electrode part 18 and the N-type electrode part 19 formed on nearly a whole area of each of an upper surface and a lower surface of the sub-mount substrate 13 in an exposed manner; and the corresponding P-type electrode part 18 and N-type electrode part 19 are electrically connected to upper surfaces of the conductive dissipation parts 22, respectively.
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Inventors:
Yuji Omori
Takai Iwai
Takai Iwai
Application Number:
JP2013096990A
Publication Date:
October 11, 2017
Filing Date:
May 02, 2013
Export Citation:
Assignee:
Citizen Electronics Co., Ltd.
CITIZEN WATCH CO.,LTD.
CITIZEN WATCH CO.,LTD.
International Classes:
H01L33/64; H01L23/12; H01L23/36
Domestic Patent References:
| JP2012146942A | ||||
| JP2012227294A | ||||
| JP2006165542A | ||||
| JP2011114154A | ||||
| JP2011119343A |
Foreign References:
| WO2012002580A1 | ||||
| WO2006035664A1 | ||||
| US20110012164 | ||||
| US20060118800 |
Attorney, Agent or Firm:
Satoshi Asakawa