Title:
LABEL BONDING DEVICE
Document Type and Number:
Japanese Patent JP2014234218
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a label bonding device in which a label is peeled from a strip label body which is formed by connection of no-separation labels, and the label is bonded to an adherend with a high accuracy.SOLUTION: A label bonding device, in which a label 1 is peeled from a strip label body 8, and the label 1 is bonded to an adherend W moving on a belt conveyor 200, comprises: a first belt mechanism 10 having a first conveyor belt 11 which moves the strip label body 8 while temporarily adhering the strip label body thereto; a second belt mechanism 20 having a second conveyor belt 21 which moves the label 1 peeled from the strip label body 8 while temporarily adhering the label thereto; a peeling mechanism 30 which peels a tip part of the strip label body 8 temporarily adhered to the first conveyor belt 11 and inverts the strip label body; and a label movement mechanism 40 which peels a beginning label 1a from the first conveyor belt 11 and moves the beginning label to the second conveyor belt 21 while pressing the tip part of the inverted beginning label 1a onto the second conveyor belt 21.
Inventors:
WAKABAYASHI KAZUYOSHI
ITO YOSHIFUMI
SUZUKI HIDEYA
ITO YOSHIFUMI
SUZUKI HIDEYA
Application Number:
JP2013117440A
Publication Date:
December 15, 2014
Filing Date:
June 04, 2013
Export Citation:
Assignee:
WE LL CORP KK
TOYOKOKI CO
KPG CORP
TOYOKOKI CO
KPG CORP
International Classes:
B65C9/18; B65C9/42
Attorney, Agent or Firm:
Tetsuro Ikuta
Ryuji Takahashi
Ueno 晋
Sugihara 誉胤
Ryuji Takahashi
Ueno 晋
Sugihara 誉胤
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