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Title:
LABEL LAMINATE, METHOD OF MANUFACTURING LABEL LAMINATE, DELIVERY SLIP AND METHOD OF PREPARING DELIVERY SLIP
Document Type and Number:
Japanese Patent JP2010175649
Kind Code:
A
Abstract:

To provide a low-cost label laminate on which visible information is printed by release a base material sheet and which easily stores the information, the label laminate being formed by laminating a release sheet 1 having a release treatment layer 12 prepared on the upper surface of a release base material 11, and an adhesive sheet 2 having a pseudo-adhesive layer 22 and an adhesive layer 23 sequentially disposed on the lower surface of the base material sheet 21.

The pseudo-adhesive layer 22 has a two layer structure including a first layer 22a and a second layer 22b. First notches 3-1 having a depth reaching the boundary between the first layer 22a and the second layer 22b from the upper surface side of the base material sheet 21 are formed so as to divide the base material sheet 21 into a plurality of areas, and second notches 3-2 having a depth reaching the boundary between at least the release treatment layer 12 and the adhesive layer 23 from the lower surface side of the release base material 11 is formed so as to be located on the inner side than the outer edge of the adhesive sheet 2. Further, the printing 4-1 is performed on an area inside the second notches 3-2 of the upper surface of the release base material 11.


Inventors:
MORIKAWA HIDEJI
OBATA SATORU
Application Number:
JP2009015907A
Publication Date:
August 12, 2010
Filing Date:
January 27, 2009
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
G09F3/02; B31D1/02; B42D11/00; B65D27/00; G09F3/00; G09F3/10
Domestic Patent References:
JPH0784523A1995-03-31
JPH0784523A1995-03-31
JP2000153846A2000-06-06
JP2003011551A2003-01-15
JP2003136861A2003-05-14
JPH06239058A1994-08-30
JP2004291570A2004-10-21
JPH0336884U1991-04-10
JPS4947599U1974-04-25
JP2009233933A2009-10-15
JP2010085576A2010-04-15
JP2010030174A2010-02-12
JP2010020156A2010-01-28
Attorney, Agent or Firm:
Seiryu Corporation