Title:
LABEL MANUFACTURING DEVICE
Document Type and Number:
Japanese Patent JP2017177633
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a label manufacturing device, which allows a position of a defective label to be surely recognized so that good labels can be replenished with high accuracy without deteriorating a work efficiency.SOLUTION: Die-cutting means comprises a first die-cutting blade 14 for die-cutting a label as a whole and a second die-cutting blade 16 for forming a rear-end die-cutting line 41A at a rear end side in a label conveying direction. On a continuous label 31 in which IC modules 35 are sequentially formed peelably on an at least peeling body 32 and conveyed, in a region where a good IC module 35 is die-cut just by the first die-cutting blade 14 into an IC label 36, a whole die-cutting line 41 is formed and an incision of the rear-end die-cutting line 41A is formed up to the peeling body 32 just by the second die-cutting blade 16, at a rear end side in the conveying direction with respect to a defective IC module 35A, so that the defective IC module 35A as a whole is rolled up together with an unwanted body without die-cutting the module.SELECTED DRAWING: Figure 3
Inventors:
MATSUYAMA KAZUMASA
Application Number:
JP2016070346A
Publication Date:
October 05, 2017
Filing Date:
March 31, 2016
Export Citation:
Assignee:
TOPPAN FORMS CO LTD
International Classes:
B31D1/02
Domestic Patent References:
| JP2014188934A | 2014-10-06 | |||
| JP2012073499A | 2012-04-12 | |||
| JP2002052629A | 2002-02-19 |
Attorney, Agent or Firm:
▲高▼橋 寛
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