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Patent Searching and Data


Title:
LABEL MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2013095502
Kind Code:
A
Abstract:

To provide a label molding apparatus thermally welding overlapped portions of a rear end and a front end of a label wound around a mandrel when welding the label moving at high speed.

A tip of the label is transferred from a transfer drum to the rotatable mandrel 24 installed in a rotating body 22, and the label is wound up by the rotation of the mandrel 24 and is sucked and held with the rear end overlapped on the front end. A heater 136 is disposed along the movement locus of the mandrel 24, and is moved for a predetermined section following the movement caused by the revolution of the mandrel 24. The heater 136 is brought into contact with the overlapped portions of the front end and rear end of the label, and is made to follow for the predetermined section, so as to weld the overlapped portions of the label.


Inventors:
HASHIMOTO MITSUO
NISHIMURA NOBORU
MICHIDA KOJI
Application Number:
JP2011242237A
Publication Date:
May 20, 2013
Filing Date:
November 04, 2011
Export Citation:
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Assignee:
SHIBUYA MACHINERY CO LTD
International Classes:
B65C3/16; B65C9/04; B65C9/06; B65C9/25
Domestic Patent References:
JPS61249739A1986-11-06
JPH05193632A1993-08-03
Foreign References:
WO2010040397A12010-04-15
Attorney, Agent or Firm:
Mamoru Aikawa