POLYIMIDE/METAL LAMINATE, ITS PRODUCTION METHOD, AND ITS USE

Title:

POLYIMIDE/METAL LAMINATE, ITS PRODUCTION METHOD, AND ITS USE

Document Type and Number:

Japanese Patent JP2005219463

Kind Code:

A

Abstract:

To provide a polyimide/metal laminate having a tightly bonded state and its production method capable of avoiding or restraining complication of its production process.

The polyimide/metal laminate comprises a polyimide layer 10 and a copper/molybdenum alloy layer 20 directly laminated on the layer 10. A copper layer (electroconductive layer) 30 laminated on the alloy layer 20 may be included. Thereby, the polyimide layer 10 is tightly bonded to the alloy layer 20, and also since the alloy layer 20 and copper layer 30 can be etched under the same condition, FPC or a multilayer structure of printed wiring board can efficiently be produced by using the above laminate.

Inventors:

NISHINAKA MASARU
ITO TAKU
MURAKAMI MUTSUAKI

Application Number:

JP2004032655A

Publication Date:

August 18, 2005

Filing Date:

February 09, 2004

Export Citation:

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Assignee:

KANEKA CORP

International Classes:

B32B15/088; B32B15/08; H05K3/00; H05K3/46; (IPC1-7): B32B15/08; H05K3/00; H05K3/46

Attorney, Agent or Firm:

Kenzo Hara

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