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Title:
LAMINATE AND METHOD FOR HEAT MELTING ADHESION
Document Type and Number:
Japanese Patent JP2002178453
Kind Code:
A
Abstract:

To provide a laminate of cyclic olefin copolymers which is excellent in heat melting adhesion properties, a method for heat melting adhesion of the laminate, and a method for the heat melting adhesion between an olefin resin and a non-olefin resin.

The laminate of a copolymer (a) comprising 40-95 mole % of a cyclic olefin unit and 5-60 mole % of an ethylene unit and a copolymer layer (b) comprising 5-39.9 mole % of the unit of a cyclic olefin expressed by formula (I) and 60.1-95 mole % of an ethylene unit is provided. The olefin resin is heat melting-adhered to the non-olefin resin by using the laminate.


Inventors:
MASUDA SEIJI
NAKANISHI HIROSHI
Application Number:
JP2000380413A
Publication Date:
June 26, 2002
Filing Date:
December 14, 2000
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
B32B27/00; B29C65/02; B32B27/32; C08F210/02; C08F232/08; (IPC1-7): B32B27/00; B29C65/02; B32B27/32; C08F210/02; C08F232/08
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)



 
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