Title:
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023145374
Kind Code:
A
Abstract:
To provide a laminate comprising a temporary fixing material and a semiconductor device and capable of easily peeling the semiconductor device from the temporary fixing material while reducing a residue, and to provide a method for manufacturing the laminate and a method for manufacturing the semiconductor device using the laminate.SOLUTION: A laminate comprises a temporary fixing material and a semiconductor device. When the temporary fixing material and the semiconductor device are peeled at 25°C by a peeling test using a flat plate cross stage method, a peeling force is greater than or equal to 0.10 N/inch and less than or equal to 5 N/inch and a tensile elongation rate of the temporary fixing material is greater than or equal to 7%.SELECTED DRAWING: None
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Inventors:
NISHIUMI YUKI
DAIDO IZUMI
SHICHIRI NORISHIGE
TAKAHASHI TOSHIO
HAYASHI SATOSHI
MORI CHIEKO
OKAYAMA HISATOSHI
DAIDO IZUMI
SHICHIRI NORISHIGE
TAKAHASHI TOSHIO
HAYASHI SATOSHI
MORI CHIEKO
OKAYAMA HISATOSHI
Application Number:
JP2023040835A
Publication Date:
October 11, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B32B7/12; H01L21/02; C08G73/10; C09J4/00; C09J179/04; C09J179/08
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus