Title:
LAMINATE MOLDING DEVICE AND POWDER BED FORMING DEVICE
Document Type and Number:
Japanese Patent JP2023007774
Kind Code:
A
Abstract:
To stably continue a molding process.SOLUTION: A laminate molding apparatus 1 includes a start plate 51 including a plate main surface 51a on which powder P1 is placed, a powder bed forming mechanism 30 that forms a powder bed PB that is the powder P1 spread evenly on the plate main surface 51a, a beam source 3b for irradiating the powder bed PB with an energy beam. The powder bed forming mechanism 30 has a powder supply mechanism 31 that supplies the powder P1, a powder coating mechanism 32 that spreads evenly the powder P1 supplied from the powder supply mechanism 31 on the plate main surface 51a by moving relatively to the start plate 51 toward a clock direction CW, and a powder amount measurement meter 33 placed in front of the powder coating mechanism 32 in a moving direction of the powder coating mechanism 32 relative to the start plate 51, after being supplied from the powder supply mechanism 31, and before evenly spreading by the powder coating mechanism 32 measures an amount of the powder P1.SELECTED DRAWING: Figure 2
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Inventors:
HAYASHI DAIKI
NAKAYAMA YUICHIRO
NAKAYAMA YUICHIRO
Application Number:
JP2021110838A
Publication Date:
January 19, 2023
Filing Date:
July 02, 2021
Export Citation:
Assignee:
IHI CORP
International Classes:
B22F12/57; B22F3/16; B22F10/28; B22F10/30; B22F12/13; B22F12/37; B22F12/55; B29C64/153; B29C64/205; B29C64/241; B29C64/245; B29C64/268; B29C64/393; B33Y30/00; B33Y50/02
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Hideki Komatsu
Yoshiki Kuroki
Hideki Komatsu