Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LAMINATE AND RESIN FILM
Document Type and Number:
Japanese Patent JP2019151815
Kind Code:
A
Abstract:
To provide a resin film and a laminate, achieving moisture heat resistance and post processing suitability while maintaining flexibility and high stability.SOLUTION: There is provided a resin film containing a polyether segment, a (meth)acryl segment, and an urethane segment, and satisfying following conditions 1 to 5. Condition 1; 5% strain stress is 10 MPa or less. Condition 2: Elastic recovery rate at deformation volume of 20% is 70% or more. Condition 3; An absolute value of dimensional change rate at 150°C is 10% or less. Condition 4; a ratio between the largest peak intensity P1 of peaks derived from a carbodiimide group and an isocyanate group in FT-IR spectrum and peak intensity P2 caused by NH stretching vibration of an urethane group, P1/P2 is 0.01 or less. Condition 5; a ratio between stress F4 when the resin film is stretched with strain amount of 100% at 23°C a stress F5 when the resin film is stretched with strain amount of 100% at 23°C after the lapse of 500 hr. at 85°C-85%,, F5/F4 is 0.4 or more.SELECTED DRAWING: Figure 1

Inventors:
YAHIRO KENSUKE
MIWA NORIFUMI
ISHIDA YASUYUKI
Application Number:
JP2018155562A
Publication Date:
September 12, 2019
Filing Date:
August 22, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/18; B32B7/06; B32B27/00; B32B27/30; B32B27/40; C08F299/06; C08G18/67; C08K5/13; C08K5/372; C08K5/51; C08L75/08
Domestic Patent References:
JPH01271412A1989-10-30
JP2016169351A2016-09-23
JP2005058288A2005-03-10
JP2019051692A2019-04-04
Foreign References:
WO2014045782A12014-03-27