Title:
セミアディティブ工法用積層体及びそれを用いたプリント配線板
Document Type and Number:
Japanese Patent JP7332049
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide: a laminate for semi-additive manufacturing for forming a multi-layer printed wiring board by electrically connecting a conductor circuit layer of an inner printed wiring member, said laminate exhibiting a high degree of adhesion between a substrate and a conductor circuit and making it possible to form wiring having a rectangular cross-sectional shape that is suitable for circuit wiring with little undercutting and good design reproducibility; and a printed wiring board using the same. The present invention is the result of the discovery that by using a laminate in which a conductive silver particle layer (M1) and a copper layer (M2) are sequentially laminated on both surfaces of an insulating substrate (A) and the copper layer (M2) has a thickness of 0.1-2 μm, it is possible to form a printed wiring board that is electrically connected to a conductor circuit layer of an inner printed wiring material, said printed wiring board exhibiting a high degree of adhesion between a substrate and a conductor circuit, and having a rectangular cross-sectional shape that is suitable for circuit wiring with little undercutting and good design reproducibility.
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Inventors:
Norimasa Fukasawa
Akira Murakawa
gray hair
Akira Murakawa
gray hair
Application Number:
JP2022533165A
Publication Date:
August 23, 2023
Filing Date:
October 21, 2021
Export Citation:
Assignee:
DIC Corporation
International Classes:
H05K3/24; H05K3/38; H05K3/42
Domestic Patent References:
| JP2017069586A | ||||
| JP7111373A |
Foreign References:
| WO2020003878A1 |
Attorney, Agent or Firm:
Takayuki Ohno
Akihiro Iwamoto
Hidefumi Sugaya
Masahiro Niwa
Akihiro Iwamoto
Hidefumi Sugaya
Masahiro Niwa