Title:
LAMINATION MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2016204720
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a lamination molding device capable of suppressing a cutting time of an abnormal sinter part, and surely removing a tip end part of the abnormal sinter part projecting from a powder layer.SOLUTION: A lamination molding device comprises: a blade for making a metallic material powder flat and forming a powder layer; a table moving in a vertical direction and on whose upper surface the powder layer is formed; a cutting device in which, a tip end of a cutting tool is arranged on a height of an upper end face of the powder layer. and which cuts a sinter layer formed by sintering the powder layer; and a numerical control part for controlling the cutting device. The numerical control part comprises a storage part for storing drop distance data for dropping the table during powder layer formation time, and cutting area data containing a horizontal projection area of the sinter layer, acquires the drop distance data and the cutting area data of the table when the blade collides to an abnormal sinter part which occurs on the sinter layer below the blade, during powder layer formation time, then controls the cutting device so as to drop the tip end of the cutting tool from the upper end face from the lower end face of the powder layer and remove the abnormal sinter part on the cutting area containing the horizontal projection area of the sinter layer.SELECTED DRAWING: Figure 4
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Inventors:
KANEKO MIKIO
Application Number:
JP2015090222A
Publication Date:
December 08, 2016
Filing Date:
April 27, 2015
Export Citation:
Assignee:
SODICK CO LTD
International Classes:
B22F3/16; B22F3/105; B33Y30/00
Domestic Patent References:
| JP2004277881A | 2004-10-07 |
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