Title:
Laminate shaping apparatus
Document Type and Number:
Japanese Patent JP6063081
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lamination molding device capable of enhancing accuracy of lamination molding.SOLUTION: A lamination molding device comprises: a chamber 1 for covering a required molding region, and which is filled with prescribed density of inert gas; and a molding table 5 disposed in the molding region, and is capable of being moved vertically by a drive mechanism. Temperature of the molding table 5 can be freely adjusted, and a thermostat part for keeping temperature almost constant, is provided between the molding table 5 and the drive mechanism, or in the drive mechanism.SELECTED DRAWING: Figure 1
Inventors:
Shuji Okazaki
Shuichi Kawada
Muranaka Katsutaka
Shuichi Kawada
Muranaka Katsutaka
Application Number:
JP2016073867A
Publication Date:
January 18, 2017
Filing Date:
April 01, 2016
Export Citation:
Assignee:
Sodick Co., Ltd.
International Classes:
B22F3/16; B22F3/105; B29C67/00
Domestic Patent References:
| JP2005089863A | ||||
| JP2002103894A |
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito
Akihiko Okuno
Hiroyuki Ito