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Patent Searching and Data


Title:
積層体
Document Type and Number:
Japanese Patent JP6968766
Kind Code:
B2
Abstract:
A structure capable of leaving a repetition of heating and cooling as a dynamic deformation amount. The structure retains joining performance of a laminated body made of two types of materials having different thermal properties.

Inventors:
Takuhei Tabada
Akihiro Mochizuki
Application Number:
JP2018152268A
Publication Date:
November 17, 2021
Filing Date:
August 13, 2018
Export Citation:
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Assignee:
Polyplastics Co., Ltd.
International Classes:
B32B3/30; B32B7/027; B32B15/08
Domestic Patent References:
JP721703Y2
JP2018111277A
Foreign References:
US20130098028
WO2004041533A1
WO2013058401A1
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi