To provide a stacked assembly of semiconductor packages, in which the adhesion at high temperatures and the solder joint area of leads are increased to enhance the impact durability.

A stacked assembly of semiconductor packages comprises a first semiconductor package 210 and at least one second semiconductor package 220. The first semiconductor package 210 comprises at least a first chip 211, multiple first outer leads 212 of a leadframe, and a first encapsulant 213. The second semiconductor package 220, which is mounted onto the first semiconductor package 210, comprises at least a second chip 221, two or more second outer leads 222 of a leadframe, and a second encapsulant 223. The second outer leads 222 are exposed on the outside of the second encapsulant 223. At least each second outer lead 222 has a U-shaped recessed cut end surface which is solder-joined to the joint of the corresponding first outer lead 212.

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