Title:
低誘電接着剤層を含有する積層体
Document Type and Number:
Japanese Patent JP6984602
Kind Code:
B2
Abstract:
Provided is a laminate which exhibits high adhesion not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, and which is able to achieve a high solder heat resistance, while having excellent low dielectric constant characteristics. A laminate (Z) which is obtained by laminating a resin base material and a metal base material with an adhesive layer being interposed therebetween, said adhesive layer containing a carboxyl group-containing polyolefin resin (A). This laminate (Z) is characterized in that: (1) the relative dielectric constant (εc) at the frequency of 1 MHz of a laminate (X) which is obtained by removing the metal base material from the laminate (Z) is 3.0 or less; (2) the dielectric loss tangent (tanδ) at the frequency of 1 MHz of the laminate (X), which is obtained by removing the metal base material from the laminate (Z), is 0.02 or less; (3) the peel strength between the resin base material and the metal base material is 0.5 N/mm or more; and (4) the moist solder heat resistance of the laminate (Z) is 240°C or more.
Inventors:
Tadahiko Mikami
Takeshi Ito
Ryo Sonoda
Hideyuki Sakata
Takeshi Ito
Ryo Sonoda
Hideyuki Sakata
Application Number:
JP2018532870A
Publication Date:
December 22, 2021
Filing Date:
June 30, 2017
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
B32B15/085; B32B7/12; B32B27/32; C09J123/26; C09J125/06; C09J135/00; C09J163/00; C09J179/04; H05K1/03; H05K3/28
Domestic Patent References:
| JP2002235061A | ||||
| JP2000104025A | ||||
| JP2000345132A | ||||
| JP10060401A |
Foreign References:
| WO2015133497A1 | ||||
| WO2017077912A1 |
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