Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
積層体、積層体の製造方法、および、電子デバイス用部材付きガラス基板の製造方法
Document Type and Number:
Japanese Patent JP5924344
Kind Code:
B2
Abstract:
The present invention relates to a laminate comprising a support plate layer, a resin layer and a glass substrate layer in this order, wherein the peel strength (y) on the interface between the support plate layer and the resin layer is higher than the peel strength (x) on the interface between the resin layer and the glass substrate or the cohesive failure strength (z) of the resin layer, a resin contained in the resin layer is a cross-linked silicone resin, the cross-linked silicone resin contains an organosiloxy unit (A-1) represented by formula (1) and an organosiloxy unit (B-1) represented by formula (2), the ratio of the sum total of the content of the component (A-1) and the content of the component (B-1) (i.e., (A-1) + (B-1)) to the total content of all of organosiloxy units is 70 to 100 mol%, and the ratio of the content of the component (A-1) to the sum total of the content of the component (A-1) and the content of the component (B-1) is 15 to 50 mol% in the cross-linked silicone resin. (In formula (1), R1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. In formula (2), R6 and R7 independently represent an alkyl group having 1 to 4 carbon atoms.)

Inventors:
Kenichi Ebata
Gutter Toshihiko Mouth
Application Number:
JP2013539636A
Publication Date:
May 25, 2016
Filing Date:
October 15, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Asahi Glass Co., Ltd.
International Classes:
B32B17/10; B32B27/00; C08G77/04; C09J183/04; G02F1/1333
Domestic Patent References:
JP2009215343A
Foreign References:
WO2007018028A1
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Takemoto Yoichi