Title:
積層体、及び、積層体の製造方法
Document Type and Number:
Japanese Patent JP6955681
Kind Code:
B2
Abstract:
A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.
Inventors:
Tetsuo Okuyama
Miki Hayashi
Shunsuke Ichimura
Toku Keiya Ta
Masahiro Yamashita
Miki Hayashi
Shunsuke Ichimura
Toku Keiya Ta
Masahiro Yamashita
Application Number:
JP2020538289A
Publication Date:
October 27, 2021
Filing Date:
August 07, 2019
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
B32B9/00; B32B17/10; B32B18/00
Domestic Patent References:
| JP2009154447A | ||||
| JP2008291063A | ||||
| JP5009316A | ||||
| JP2018094790A | ||||
| JP2013049743A | ||||
| JP2012229402A | ||||
| JP2017124586A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office