積層体、およびレジストパターン形成方法

Title:

積層体、およびレジストパターン形成方法

Document Type and Number:

Japanese Patent JP4545524

Kind Code:

B2

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Inventors:

Taku Hirayama
Daishi Shiono
Hideo Haneda

Application Number:

JP2004242093A

Publication Date:

September 15, 2010

Filing Date:

August 23, 2004

Export Citation:

Assignee:

Tokyo Ohka Kogyo Co., Ltd.

International Classes:

G03F7/11; G03F7/004; G03F7/039; H01L21/027

Domestic Patent References:

Foreign References:

WO2004074937A1

Other References:

門田敏明他,アモルファス分子材料-新規高感度電子線用分子性レジストの開発,高分子学会予稿集,日本,高分子学会,2001年 9月12日,50巻12号,2941頁

Attorney, Agent or Firm:

Sumio Tanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Noriko Yanai

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