Title:
積層超硬チップ及びその製造方法
Document Type and Number:
Japanese Patent JP5256384
Kind Code:
B2
More Like This:
Inventors:
Hatsumi Yoshimi
Application Number:
JP2006312803A
Publication Date:
August 07, 2013
Filing Date:
November 20, 2006
Export Citation:
Assignee:
Star Roy Co., Ltd.
International Classes:
B22F7/00; B22F7/06; B23K1/00; C22C29/08; E21B10/46; E21D9/087
Domestic Patent References:
| JP48075443A | ||||
| JP2006257467A | ||||
| JP7300375A | ||||
| JP43012982B1 | ||||
| JP53001609A | ||||
| JP59136404A |
Attorney, Agent or Firm:
Hiroshi Sugawara