To provide a laminated ceramic device which is improved in functionality and reliability, reduced in size and height, and can be manufactured easily.
The laminated ceramic device contains a first ceramic body 1 having multilayered wiring patterns 2 which are electrically connected to each other through interlayer via holes 3, a second ceramic body having multilayered wiring patterns 2 which are electrically connected to each other through interlayer via holes 3, and a thermosetting resin sheet 17 sandwiched between the first and second ceramic bodies. The resin sheet 17 has through holes filled up with a conductive resin which connect some of the multilayered wiring patterns of the first ceramic body 1 to some of the multilayered wiring patterns 2 of the second ceramic body.
URYU KAZUHIDE
MATSUMURA TSUTOMU
ISHIZAKI TOSHIO
