To provide a manufacturing method of a laminated ceramic electronic component capable of making diameters approximately equal at both longitudinal ends of a through-hole when forming the through-hole for filling conductive paste to serve as a through-conductor, and further shaping the through-hole to be symmetric with respect to its longitudinal center, and to provide the laminated ceramic electronic component.
In forming the through-hole 38 on a raw laminate 34, the method is employed which includes steps of forming part 38a of the through-hole after irradiating laser light 39 from the first principal plane 36 of the laminate 34 to form part 38a of the through-hole and thereafter irradiating laser light 40 from a second principal plane 37 to form the remaining through-hole 38b. Thus, the diameters at both ends of the through-hole 38 are made approximately equal.
TANIGUCHI MASAAKI
KAWAGUCHI YOSHIO
| JP2003158038A | 2003-05-30 | |||
| JPH07142283A | 1995-06-02 |
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