Title:
積層セラミック電子部品、積層セラミック電子部品の製造方法及び電子部品内蔵基板
Document Type and Number:
Japanese Patent JP7089426
Kind Code:
B2
Abstract:
A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes.
Inventors:
Takashi Sasaki
Application Number:
JP2018137508A
Publication Date:
June 22, 2022
Filing Date:
July 23, 2018
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/30; H01G2/06; H01G4/228; H01G4/232; H01G4/40
Domestic Patent References:
| JP2015008313A | ||||
| JP2012028457A | ||||
| JP2013051336A | ||||
| JP2014192321A |
Foreign References:
| US20190189348 |
Attorney, Agent or Firm:
Patent Business Corporation Minami Aoyama International Patent Office
Junichi Omori
Ayako Chiba
Junichi Omori
Ayako Chiba
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