To prevent a disconnections in a through hole due to the difference in shrinkage ratio between a conductor pattern and an insulating sheet at baking and to prevent disconnections between a coil and a capacitor due to the difference in the shrinkage ratio and the difference in reactivity between two kinds of conductor patterns.

An insulating sheet, where a conductor is formed is laminated on the top surface of a conductor pattern at a position facing a through-hole. Then the through hole is filled with a conductor to connect the conductor pattern of an upper layer and the pattern of a lower layer to each other. Consequently, a conductive material can be supplied from the conductor formed on the top surface of the conductor pattern into the through-hole, so no disconnection is made in the through-hole.