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Patent Searching and Data


Title:
LAMINATED CHIP VARISTOR AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2004214643
Kind Code:
A
Abstract:

To provide a laminated chip varistor having small deterioration in varistor characteristics, even when the surface of an external electrode is further plated, and to provide its manufacturing method.

A laminated chip varistor 1 is provided with a varistor element assembly 1, having a plurality of varistor layers 1a, 1b, and 1c and internal electrodes 2a and 2b, arranged so as to sandwich each varistor layer, external electrodes 3a that are formed at the end part of this varistor element assembly 1 and that are connected with the internal electrodes, and glass layers 4 formed between the varistor element assembly 1 and the external electrodes 3a. Moreover, a plating layer 3b and a plating layer 3c are formed on the surface of the external electrode 3a.


Inventors:
TAKEHANA MAKIKAZU
HIROSE OSAMU
OCHIAI TOSHIAKI
Application Number:
JP2003418576A
Publication Date:
July 29, 2004
Filing Date:
December 16, 2003
Export Citation:
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Assignee:
TDK CORP
International Classes:
H01C17/28; H01C7/10; (IPC1-7): H01C7/10; H01C17/28
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Toyotaka Abe