Title:
LAMINATED CURABLE RESIN STRUCTURE, DRY FILM, CURED PRODUCT AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022159249
Kind Code:
A
Abstract:
To provide a laminated curable resin structure from which a cured product that has high resolution and crack resistance and excellent adhesion to metal plating can be obtained.SOLUTION: A laminated curable resin structure is composed of two resin layers in which an X layer composed of an alkali-soluble resin composition X and a Y layer composed of an alkali-soluble resin composition Y are laminated, wherein the X layer is 5% or more and 30% or less of the thickness of the total two resin layers combined with the Y layer, and in a cured product with a thickness of 20 to 30 μm by light irradiation of 1,000 mJ/cm2 and heat treatment at 160°C for one hour, a coefficient of thermal expansion at 200 to 250°C by thermomechanical analysis is 110 ppm/°C or less.SELECTED DRAWING: Figure 1
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Inventors:
UEDA CHIHO
SHIBATA DAISUKE
SHU SHOTARO
SHIMADA SAWAKO
KATO FUMITAKA
SHIBATA DAISUKE
SHU SHOTARO
SHIMADA SAWAKO
KATO FUMITAKA
Application Number:
JP2022061168A
Publication Date:
October 17, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/095; B32B7/027; B32B27/16; B32B27/18; B32B27/20; B32B27/38; G03F7/004; G03F7/027; H05K3/28
Attorney, Agent or Firm:
Honda Ichiro
Yumiko Sugimoto
Takumi Watanabe
Takashi Daejeon
Takashi Fujimura
Yumiko Sugimoto
Takumi Watanabe
Takashi Daejeon
Takashi Fujimura