Title:
LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3422134
Kind Code:
B2
Abstract:
PURPOSE: To obtain small laiminated electronic components which hardly generate improper shape or laminate slip, need few manufacturing steps and need a short manufacturing period.
CONSTITUTION: Holes for internal electrodes and for through holes are respectively made through first and second insulating sheets 2 by such means as laser machining. In the next step, after insulating sheets 121-12n are made by junctioning the first and the second sheets, conductive paste is applied by a printing means and is filled. The conductive paste which fills the holes for internal electrodes is made into internal electrodes 131∼13n and the conductive paste which fills the throug hholes is made into through holes 201, 202, 203.... The insulating sheets 121-12n which include the internal electrodes 131-13n and the through holes 201, 202... are laminated, baked and integrated.
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Inventors:
Shingo Okuyama
Masatoshi Ariki
Tadahiro Nakagawa
Masatoshi Ariki
Tadahiro Nakagawa
Application Number:
JP16236895A
Publication Date:
June 30, 2003
Filing Date:
June 28, 1995
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01F41/04; H01F17/00; H05K3/46; (IPC1-7): H01F41/04; H01F17/00
Domestic Patent References:
| JP7130543A | ||||
| JP7106175A | ||||
| JP766555A | ||||
| JP5299841A |
Attorney, Agent or Firm:
Takekazu Morishita
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