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Patent Searching and Data


Title:
LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JPH11260653
Kind Code:
A
Abstract:

To provide a laminated electronic component with a terminal electrode capable of increasing the mounting density on a printed board.

A rectangular parallelepiped laminated electronic part includes one or more inner elements in a laminated body 5. A terminal electrode 4 formed by the use of a component member in a conductive layer is provided at each edge of the laminated body 5 in the laminating direction. The edge face of the terminal electrode 4 in the laminating direction is covered with a coating layer 1B made up of an insulating body or resistance body. In this case the terminal electrode 4 and the coating layer 1B are formed by laminating the green sheets to manufacture a laminated electronic component.


Inventors:
KUMAGAI OSAMI
ABE TOSHIYUKI
SATO MINORU
OGIMOTO TATSUO
KOBAYASHI MAKOTO
SAITO NORIYUKI
Application Number:
JP6494998A
Publication Date:
September 24, 1999
Filing Date:
March 16, 1998
Export Citation:
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Assignee:
TDK CORP
International Classes:
H03H5/02; H01F17/00; H01F27/29; H01F41/04; H01G4/252; H01G4/40; H03H7/075; H01C7/02; (IPC1-7): H01F27/29; H01F17/00; H01F41/04; H01G4/252; H01G4/40
Attorney, Agent or Firm:
Shoichi Wakata