Title:
LAMINATED ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3257531
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To narrow the arrangement pitch of external electrodes by exposing at least the side portion of a via hole by cutting an insulating sheet so as to expose the via hole on a first half portion, and by forming a shield electrode at least on the side plane of a laminated body.
SOLUTION: As in a laminated electronic component 10c, several external electrodes 12 are formed based on via holes and other external electrodes, for example, a shield electrode 25, may be formed by other method. The shield electrode 25 is formed, for example, by forming a groove having an inner plane whereupon the shield electrode 25 is to be formed. Then, the groove is filled with a metallic paste, the groove is cut again so as to cut the conductive material provided by the metallic paste, and the groove is formed. The shield electrode 25 is often electrically connected with an inner circuit element on the earth side of the laminated body.
Inventors:
Norio Sakai
Kenji Kubota
Shoichi Kawabata
Kenji Kubota
Shoichi Kawabata
Application Number:
JP1479299A
Publication Date:
February 18, 2002
Filing Date:
January 22, 1999
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01F17/00; H01G4/232; H01G4/30; (IPC1-7): H01G4/30; H01F17/00; H01G4/232
Domestic Patent References:
| JP5129873A | ||||
| JP60183747A | ||||
| JP61269336A |
Attorney, Agent or Firm:
Hisaro Fukami (1 person outside)