To provide a non-halogen based gas barrier film excellent in gas barrier properties under the high humidity environment after being subjected to a boiling treatment and a retort treatment.

This laminated film is formed by bonding a gas barrier film and a sealant film. In the gas barrier film, the ratio of the oxygen permeability at 23°C and relative humidity of 60% (A) to that at 23°C and relative humidity of 80% (B) ((B)/(A)) is not less than 2.0. The adhesive used for laminating the gas barrier film and the sealant film is a laminating adhesive mainly based on an epoxy resin and an epoxy resin curing agent. The laminated film contains not less than 40% by weight of a specific skeleton structure in the epoxy resin curing agent formed by the laminating adhesive.