Title:
LAMINATED FILM, FLEXIBLE METAL-CLAD LAMINATE, AND METHOD FOR PRODUCING FLEXIBLE METAL-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2023102267
Kind Code:
A
Abstract:
To provide a laminated film having a low dielectric loss tangent, a low linear expansion coefficient, and an adhesion property with a metal layer, a flexible metal-clad laminate obtained using the laminated film, and a method for producing the flexible metal-clad laminate.SOLUTION: There is provided a laminated film having at least a surface resin film and a substrate resin film. The surface resin film has a dielectric loss tangent of 0.005 or less at 20GHz and contains a bismaleimide compound. The substrate resin film has a linear expansion coefficient of 30 ppm/K or less.SELECTED DRAWING: None
Inventors:
YASUI NOBUYOSHI
UCHIDA NORIYUKI
KAWAHARA RYOSUKE
WATANABE RYOICHI
DEGUCHI HIDEHIRO
UCHIDA NORIYUKI
KAWAHARA RYOSUKE
WATANABE RYOICHI
DEGUCHI HIDEHIRO
Application Number:
JP2022202275A
Publication Date:
July 24, 2023
Filing Date:
December 19, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B32B27/00; B32B7/022; B32B7/025; C08F22/40; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Firm WisePlus
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