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Patent Searching and Data


Title:
LAMINATED INDUCTOR-INCORPORATING MULTILAYER WIRING BOARD, TUNER MODULE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2011082371
Kind Code:
A
Abstract:

To provide a multilayer wiring board capable of preventing or suppressing degradation of an inductor characteristic.

In a first inductor 21, coil wires 1-3 arranged on a layer basis on a plurality of layers of a printed wiring board 20 are connected among the layers. In a second inductor 22, coil wires 4-6 arranged on a layer basis on a plurality of layers different from those of the first inductor 21 are connected among the layers, and partially or entirely overlap those of the first inductor 21 in a plan view. Two wire arrangement directions DL1, DL2 of the first and second inductors 21, 22 are shifted from the same linear shape.


Inventors:
OKA SHUICHI
Application Number:
JP2009234022A
Publication Date:
April 21, 2011
Filing Date:
October 08, 2009
Export Citation:
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Assignee:
SONY CORP
International Classes:
H05K3/46; H01F17/00; H01F27/00
Attorney, Agent or Firm:
Takahisa Sato