Title:
LAMINATED MATERIAL FOR CIRCUIT
Document Type and Number:
Japanese Patent JP3966630
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject material having a low dielectric constant, excellent heat resistance, sufficient peel strength at a room temperature, not causing scattering of resin in cutting, etc., having excellent handleability by laminating an adhesion layer of a specific composition to a releasable film.
SOLUTION: This material is obtained by laminating an adhesion layer composed of (A) a siloxane-modified polyimide, (B) a compound containing two methylallyl groups of formula I (R is methyl) and (C) a compound containing two or more maleimide groups in the ratio of 10-900 pts.wt. of the total of the components B and C based on 100 pts.wt. of the component A and 0.1-2 equivalent methylallyl of the component B based on 1 mol equivalent maleimide of the component C to one side of a releasable film or a metal foil. A siloxane- modified polyimide comprising 90-40 mol% of a unit of formula II (X is a tetrafunctional aromatic group such as 3,3',4,4'-diphenyl sulfone or the like; Ar is a bifunctional group such as a group of formula III or the like) and 10-60 mol% of a unit of formula IV (R is a 1-10C alkylene or methylene or -CH2OC6 H4- in which methylene is bonded to Si; n is 1-20) is preferable as the component A.
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Inventors:
Takeshi Hashimoto
Masaharu Kobayashi
Takeru Sato
Daisuke Orino
Masaharu Kobayashi
Takeru Sato
Daisuke Orino
Application Number:
JP33197998A
Publication Date:
August 29, 2007
Filing Date:
November 06, 1998
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C08L79/08; H05K1/03; B32B15/08; B32B27/34; C08F212/34; C08F222/40; C08F283/00; C08L25/02; C08L25/18; C08L35/00; H05K3/46; (IPC1-7): C08L79/08; B32B15/08; B32B27/34; C08F212/34; C08F222/40; C08L25/02; C08L35/00; H05K1/03; H05K3/46
Domestic Patent References:
| JP2000143734A | ||||
| JP9025471A | ||||
| JP5230368A |
Attorney, Agent or Firm:
Masaaki Kobayashi