Title:
積層造形装置および積層造形方法
Document Type and Number:
Japanese Patent JP6707812
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide means for accurately molding a plurality of materials having melting points in the same layer in a lamination molding apparatus that laminates layers to manufacture a three-dimensional structure.SOLUTION: A lamination molding apparatus 1 that laminates layers to mold a three-dimentional structure has: a material supply part 2 which supplies each of a first material, a second material and a third material to a predetermined position in the layer; and a heating part 3 which heats the second material at least in supplying the second material, in which the material supply part 2 supplies the third material having a melting point between a melting point of the first material and a melting point of the second material to a position sandwiched by the first material and the second material.SELECTED DRAWING: Figure 1
Inventors:
Kazunobu Umemoto
Application Number:
JP2015123448A
Publication Date:
June 10, 2020
Filing Date:
June 19, 2015
Export Citation:
Assignee:
NEC
International Classes:
B29C64/336; B22F3/105; B22F3/16; B29C64/165; B29C64/268; B33Y10/00
Domestic Patent References:
| JP2014136311A | ||||
| JP2015175013A | ||||
| JP9272153A | ||||
| JP2013075390A | ||||
| JP2016182735A |
Foreign References:
| US20100195122 |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka