Title:
積層造形装置
Document Type and Number:
Japanese Patent JP6964801
Kind Code:
B2
Abstract:
This layering/molding device performs additive processing by layering a melted processing material (7) at a processing position while moving the processing position over a workpiece (3), and forms a molded object (4) by repeating the additive processing. The layering/molding device is characterized by comprising: a processing optical system (20) that forms, at the processing position, processing light for melting the processing material (7); a line illuminator (8) that radiates illumination light for measurement to a measurement position which is different from the processing position on the workpiece (3); a light-receiving optical system (30) provided with a light-receiving part (17) that receives reflected light resulting from reflection of the illumination light at the measurement position; and a calculation unit that calculates, on the basis of a position at which the reflected light is received on the light-receiving part (17), the height of the molded object (4) that is formed on the workpiece (3). The layering/molding device is further characterized in that the light-receiving optical system (30) comprises a light-blocking mask (15) that allows light to pass at a light-forming position of reflected light which is reflected at the measurement position and enters the light-receiving part (17), and that blocks light at a light-forming position of light that enters from the processing position.
Inventors:
Hide Takushima
Hiroyuki Kono
Ryoji Sawa
Daiji Morita
Hiroyuki Kono
Ryoji Sawa
Daiji Morita
Application Number:
JP2020556460A
Publication Date:
November 10, 2021
Filing Date:
November 09, 2018
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B22F12/90; B22F12/45; B29C64/386; B33Y30/00; B33Y50/02
Domestic Patent References:
| JP2015157420A | ||||
| JP2009083326A | ||||
| JP8112862A | ||||
| JP2012242134A |
Foreign References:
| WO2018053299A1 |
Attorney, Agent or Firm:
Jun Takamura