Title:
LAMINATED MULTI-CHIP SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3538123
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mass storage multi-chip semiconductor device for ensuring high reliability of a connection part.
SOLUTION: In a stack multichip semiconductor device, plural tape carriages where semiconductor chips are connected electrically to film carrier tapes having wiring patterns on at least one face are laminated/connected via connector frames 2a and 2b. A lead 15a of the film the carriage package is extended, so that it protrudes to a side outside of the end faces of connector frame terminals 26a and 27b and a solder fillet is formed between the tape carrier packages via the lead 15a extended, so that it protrudes and connect them.
Inventors:
Sakaguchi, Masaru
Ishida, Toshiharu
Ashizawa, Koji
Tanaka, Hiroyuki
Miyano, Ichiro
Yamazaki, Kazuo
Yamada, Munehiro
Ishida, Toshiharu
Ashizawa, Koji
Tanaka, Hiroyuki
Miyano, Ichiro
Yamazaki, Kazuo
Yamada, Munehiro
Application Number:
JP2000204078A
Publication Date:
June 14, 2004
Filing Date:
January 27, 1992
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L25/18; H01L25/10; H01L25/11; (IPC1-7): H01L25/10; H01L25/11; H01L25/18
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