Title:
LAMINATED SHEET AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2001328205
Kind Code:
A
Abstract:
To provide a copper-clad laminated sheet reduced in warpage after etching.
Copper foils are arranged to both outermost surfaces of a layer comprising one or more prepregs impregnated with a PTFE resin and a molten fluoroplastic resin with a melt viscosity of 101 poise or less is arranged between the prepreg layer and the copper foils and the whole is molded under pressure so that each of the molten fluoroplastic resin layers becomes a thickness larger than 2 μm but twice or less the thickness of each copper foil.
Inventors:
HASHIMOTO SATORU
KANZAKI HITOSHI
ONISHI KAKUJI
ICHINO YASUHIKO
TANII TOSHIMITSU
NAKAI TOSHIHARU
KANZAKI HITOSHI
ONISHI KAKUJI
ICHINO YASUHIKO
TANII TOSHIMITSU
NAKAI TOSHIHARU
Application Number:
JP2000148439A
Publication Date:
November 27, 2001
Filing Date:
May 19, 2000
Export Citation:
Assignee:
NIPPON PILLAR PACKING
International Classes:
C08J5/24; B29C43/18; B32B15/08; B32B15/082; H05K1/03; (IPC1-7): B32B15/08; B29C43/18; C08J5/24; H05K1/03
Domestic Patent References:
| JPH06344503A | 1994-12-20 | |||
| JPH0379343A | 1991-04-04 | |||
| JPH05138741A | 1993-06-08 | |||
| JPS63199636A | 1988-08-18 | |||
| JPS63173638A | 1988-07-18 | |||
| JPS62216742A | 1987-09-24 | |||
| JPH0518054U | 1993-03-05 |
Attorney, Agent or Firm:
Nanjo Hiromichi