Title:
LAMINATED SHEET FOR PUNCHING AND METHOD FOR PUNCHING USING THE SAME
Document Type and Number:
Japanese Patent JP2001246696
Kind Code:
A
Abstract:
To provide a laminated sheet for realizing high quality and punchability required in the case of punching a multilayer printed circuit laminate or the like and a precision equipment or the like.
The laminated sheet for punching is obtained by laminating a polyester resin composition blended with an inorganic filler of 3 to 50 mass pts. and/or a water soluble aggregate of 1 to 10 mass pts. and a metallic foil on a thermoplastic polyester resin of 100 mass pts. A method for punching using the laminated sheet is provided.
Inventors:
WAKAMURA KAZUYUKI
NAKAYAMA YASUKI
AKI KENZO
NAKAYAMA YASUKI
AKI KENZO
Application Number:
JP2000058925A
Publication Date:
September 11, 2001
Filing Date:
March 03, 2000
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
B23B35/00; B23B41/00; B26F1/16; B32B15/08; B32B15/09; C08K3/00; C08K5/42; C08L67/02; H05K1/03; (IPC1-7): B32B15/08; B23B35/00; B23B41/00; B26F1/16; C08K3/00; C08K5/42; C08L67/02; H05K1/03
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